Thermal Eutectic Bonder

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Thermal Eutectic Bonder

 ACF Bonding Process

  • ACF : Film typed adhesive disperses the conductive balls into the compound of polymer resins.
  • ACF Bonding by Themal Eutectic Bonder

 Results of  ACF Bonding

  • Alignment accuracy : 1.69 um
  • Align Accuracy is less than 1um

 Results of  Thermal  Compression  Bonding Module

  1. Pressing Force Uniformity

  • Top/Bottom Chuck flatness : ≤ ±1㎛
  • Pressing Force uniformity of 300mm : ≤ ± 5%

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