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Pol Lamination & Auto Clave System

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Pol Lamination & Auto Clave System

Pol Lamination & Auto Clave System

  Features

  • Experience in Bonding & Lamination Process for Semiconductor(TSV, FOWLP) Wafer handling
  • Pol Film Lamination and Auto Clave ์ผ์ฒดํ˜• ์„ค๋น„
  • Lamination module using Roll to Roll unit

  Specifications 

  • Substrate Size : Φ300mm
  • Film Cutting Accuracy : ≤ ±20ใŽ›
  • Film Lamination Accuracy : ≤ ±50ใŽ›
  • Autoclave Pressure : max. 10Bar
  • Autoclave Temperature : max. 150โ„ƒ ± 2%
  • Void Free : @>1 µm

KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.

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