Wafer Bonding System

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Wafer Bonding System
Temporary Wafer Bonding System  

Systems temporarily bonding carrier wafers (or panel) to device wafers (or penal) in the fan-out packaging process and semiconductor TSV stacking process

Systems separating the bonded carrier wafer (or panel) again when subsequent processes such as back grinding, RDL and bumping are completed in the temporary bonding state

Systems can be equipped a thermal or laser heating source to electrically connect the electrodes (or bumps) of different or same types of chips through low-temperature bonding.


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