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Wafer Bonding System
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Wafer Bonding System |
PRODUCTS
Systems temporarily bonding carrier wafers (or panel) to device wafers (or penal) in the fan-out packaging process and semiconductor TSV stacking process
Systems separating the bonded carrier wafer (or panel) again when subsequent processes such as back grinding, RDL and bumping are completed in the temporary bonding state
Systems can be equipped a thermal or laser heating source to electrically connect the electrodes (or bumps) of different or same types of chips through low-temperature bonding.
KOSTEK SYSTEMS, INC.
231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515
Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.
KOSTEK SYSTEMS, INC. 231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515 Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.