In the state of Micro LED electrode (Pad) of the Front Plane and the electrode (Pad or Micro Bump) of the Back Plane which they are temporarily bonded after aligned each others, this system can bond them by laser heating method available at low temperature.

As a manufacturing equipment for micro LED TV, it is an equipment capable of bonding 6 inch to 12.7 inch size boards.

Copper Alloy, SnAg, AuSn, Au, Ag, etc. are used for pad or micro bump material for low melting point bonding.

  Features

• Eutectic Bonding by using Laser  for  overcoming the difference of CTE between Front Plane and Back Plane
• As the alloy materials for electric pad or bump, Copper Alloy, Au Alloy, SnAg and AuSn, etc. are used.
• Automatic Pressure Control
• Front Plane/Back Plane: 6~12.7inch size substrate 

  Specifications

• Align Accuracy : ≤ ±2μm
• Pressing force : Max.  3kgf
• Heater : Max. 200˚C
• As the alloy materials for electric pad or bump, Copper Alloy, Au Alloy, SnAg and AuSn, etc. are used.