Semiconductor Equipment |
Temporary Wafer Bonding System
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Wafer Bonding System |
PRODUCTS
In Fan-out Wafer (Panel) Level Packaging processes, for releasing warpages of wafers induced by molding process after wiring processes of wafers such as RDL, bumping etc. this system can be used to temporarily bond carrier wafers (glass) and device wafers(panel) which each chips relocated on the front side.
And, in case of TSV processes for semiconductor stacking, to carry out RDL or Bumping process steps on the back side of device wafer after grinding the back side of device wafers to make ultra-thin thickness, this system can be used for temporarily bonding Carrier Wafers to Device Wafers on which adhesives coated or laminated.
Depending on the type of adhesives, such as glue or film, different post-treatments must be applied. That is, for the glue type, coating and pre-curing, and for the film type, the laminating process is applied. After aligning the two substrates to match each other in a vacuum, temporary bonding is performed by thermo-compression method.
Features
Specifications
KOSTEK SYSTEMS, INC.
231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515
Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.
KOSTEK SYSTEMS, INC. 231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515 Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.