Wafer Bonding System

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Wafer Bonding System

Fan-out Packaging Process with TB DB 

  The Processes available by TB DB    

  1. Adhesive film Lamination
  2. Carrier Wafer Bonding
  3. Square Carrier Removal
  4. Carrier Wafer De-bonding/Adhesive film Peel off

     *TB DB: Temporary Wafer Bonder & De-bonder

TSV(HBM) Process Flow with TB DB     

  The Processes available by TB DB     

  1. Adhesive Spin coating / Lamination
  2. Carrier Wafer Temporary Bonding
  3. Carrier Wafer De-bonding

     *TB DB: Temporary Wafer Bonder & De-bonder

Necessity of Bonding & De-bonding Process    

  1. Fan-out WLP  

  2. TSV  

  • Carrier Bonding => Device Wafer Back Grinding and Mold Wafer Warpage Prevention and Post Process Purpose
  • Maintaining heat resistance, chemical resistance function and bonding in post process

KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

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