Semiconductor Equipment |
Temporary Wafer Bonding System
Home > Products > Semiconductor Equipment > Wafer Bonding System > Temporary Wafer Bonding System > More
Wafer Bonding System |
PRODUCTS
Temporary Wafer Bonding System can improve throughput by increasing the number of bonding modules. If the temporary adhesive is glue, a spin coater and a soft curing device are composed. If the temporary adhesive is a film type, it becomes a wafer bonding system by replacing it with a lamination module.
Temporary Bonding Process Flow : Glue / Film Adhesive
1. Glue type Adhesive
2. Film type Adhesive
Fan-out WLP Bonding Process Flow : Glue Adhesive
Fan-out WLP Bonding Process Flow : Film Adhesive
Fan-out PLP Bonding Process Flow : Film type Adhesive
KOSTEK SYSTEMS, INC.
231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515
Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.
KOSTEK SYSTEMS, INC. 231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515 Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.