Temporary Wafer Bonding System

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Wafer Bonding System

Temporary Wafer Bonding System

Temporary Wafer Bonding System can improve throughput by increasing the number of bonding modules. If the temporary adhesive is glue, a spin coater and a soft curing device are composed. If the temporary adhesive is a film type, it becomes a wafer bonding system by replacing it with a lamination module.

 Temporary Bonding Process Flow : Glue / Film Adhesive

  1. Glue type Adhesive

  2. Film type Adhesive

 Fan-out WLP Bonding Process Flow :  Glue  Adhesive

 Fan-out WLP Bonding Process Flow : Film Adhesive

 Fan-out PLP Bonding Process Flow : Film type Adhesive


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