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Chip Transfer System

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Chip Transfer System (Wafer Bonder)

 Chip Transfer Process  Flow

  • Glue Adhesive by spin coating
  • Film Adhesive by lamination

 Results of Chip Transfer Process

  • Transferred Yield Rate : Over  99.999%
  • Our Process is verified under 50um chip size !!

 Spin Coating Process 

  Specifications

  • Wafer size : 4,6,8,12 inch
  • Spin rpm : Max. 3000 rpm
  • EBR : 1~5 mm control
  • Backside Rinse Nozzle : 2 ea
  • Hot Plate Temp. : max. 300 ℃
  • Coating Uniformity  : ±0.3% (Edge exclusion : 5mm/25points)

KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.

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