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OCA/OCR Bonding System

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OCA/OCR Bonding System

  Features

  • 3 Bonding chambers and 1 Spin Coating (or Film laminating) module according to bonding process
  • Bonding System using Optical Clear Adhesive(OCA/OCR)
  • Bonding module using Vision Align Camera to achieve  precise alignment
  • Automatic Adjustment of Lower and Upper Chucks Parallelism by Control Unit
  • Damage free through uniform pressing
  • Rigid (or Flexible) to Rigid OCA bonding available

  Specifications

  • Substrate Size : Φ300mm
  • Optical Alignment Accuracy : ≤ ±1µm
  • Total Thickness Variation : ≤ ±3µm
  • Void/Particle Free after bonding in Vacuum
  • Panel Damage Free after bonding

KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.

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