This system temporarily bond the rectangular carrier glass substrate, on which transferred  the micro LED Red, Green and Red chips, to the TFT/CMOS driver board for electrically  interconnecting each other.

ACF, bumps are used as electrical connection media, and also direct bonding between each electrodes without using bumps or conductive balls can be used.

  Features

• Substrate Size : up to 12.7” Panel
• 2-step Optical Alignment (Rough and Fine Alignment)
• Automatic Chuck Parallelism Adjustment Units with 4 Laser Displacement Sensors and 4 Tilting servo press units and Wedge error compensation
• 4 Isolators for anti-vibration
• Atm or Vacuum optional

  Specifications

• Vacuum Pre bonding : < 0.5torr
• Align accuracy : ≤ ±2㎛
• Chuck to Chuck parallelism Accuracy: ≤ 5㎛
• Pressing Force : Max. 30kN
• Throughput: 12 substrates/hr (depending on material’s property)