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Pre-Aligner

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Wafer Transfer System

Vacuum Grip Pre-Aligner

  Features

  • High speed enabled by the units able to center wafers and perform angle alignment without a separate chucking
  • Wafer size and notch/flat are automatically recognized, eliminating the need for host controller settings.
  • Built-in controller for a compact design.
  • High throughput is realized by utilizing analogue type photo receiver for line sensor

  Specifications

Item

Specification

Handling Object

200 ~ 300 mm SEMI standard Silicon wafer

(orientation flat, notch)

Processing time

2.5 seconds or less (when processing 300mm)

Alignment accuracy

XY=±0.1mm or less T=±0.1°or less

Wafer off-center limit

±5mm or less (wafer offset from chuck center)

Wafer holding method

Backside vacuum chuck (55 mm)

Alignment sensor

Edge detection by line sensor to discriminate light intensity

Power source

24V DC±10%, 5A, 1-line

Vacuum

-80KPa or less, 1-line

Weight

Approx. 12kg



Edge Grip Pre-Aligner

  Features

  • This 300mm mechanically clamping wafer aligner minimizes wafer particle contamination by avoiding contact with the backside of the wafer
  • Clean alignment enabled by limiting contact to the wafer edge
  • Configurable for compound semiconductor wafers and glass wafers.   
  • Built-in controller for a compact design

  Specifications

Item

Specification

Handling Object

200 & 300 mm SEMI standard Silicon wafer

Processing time

8 seconds or less (when processing 300mm)

Alignment accuracy

±0.2°or less

Wafer holding method

Wafer-edge partial gripping

Wafer contact material

PEEK

Control system

Command control through RS-232C interface

Power source

24V DC±10%, 3A, 1-line

Dry air

6-mm tubing, 0.35-0.4MPa,

10 liters/min or more

Weight

Approx. 8kg


KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

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