Semiconductor Equipment |
Collective Die to Wafer Bonding System
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Wafer Bonding System |
PRODUCTS
Collective Die to Wafer Bonding System |
This system is a gang bonding equipment which P&Ps chips on the front side of the device wafer and then presses them all at once to increase the productivity, and adopted Thermal Compression Chip Bonding to connect the chips electrically.
Another system is configured with equipment for 2-step processes. That is, an Aligner & Pre-bonder aligning and temporarily bonding the chips on the carrier wafer with the chips of other device wafers after P&P transferring the chips to the front side of the carrier wafer, and an eutectic main bonder which performs bonding through thermo-compression or laser heating method.
Electrical connections are made by bump-to-electrode or electrode-to-electrode eutectic bonding using low melting point electrodes.
Features
Specifications
- Align Accuracy : ≤±2um
- Throughput : 15 wafers/h
- Throughput of Thermal compression wafer bonder : 3 wafers/h
- Throughput of Laser Eutectic bonder : 20 wafers/h
KOSTEK SYSTEMS, INC.
231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515
Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.
KOSTEK SYSTEMS, INC. 231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea
TEL : +82-31-646-1500 FAX : +82-31-646-1515 Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.