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  • Temporary Wafer Bonding System 
  • Wafer De-bonding System 
  • Wafer Transfer System (Vacuum Cluster System, EFEM, Robot, LPM) 



  • Chip Transfer System
  • Aligner & Pre-bonder
  • Thermal Eutectic Bonder
  • Laser Eutectic Bonder
  • OCA/OCR Bonding System
  • Pol Lamination & Auto Clave System 
  • EFEM(Mask/Wafer) 



KOSTEK SYSTEMS, INC. 

231, bangkkojigil, Seotan-Myeon, Pyeongtaek-Si, Gyeonggi-Do, Korea

TEL : +82-31-646-1500  FAX : +82-31-646-1515

Email : Sales@kosteks.com

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