We contributed to the semiconductor industry by localizing the Vacuum Cluster System required for the semiconductor Fab equipment at the first time in Korea.

In addition,  as results of continuous R&D for business diversifications, we are localizing the next-generation semiconductor packaging equipment(TSV, Fan-out) such as Wafer to Wafer bonder & De-bonder, and selling them to the customers of semiconductor companies.

And more, the next-generation displays; that is,  micro LED display and OLEDoS display manufacturing equipment, such as Glass to Wafer Bonder, Chip Transfer System, Micro LED RGB Array Aligner & Pre-bonder, Thermal Eutectic Bonder, and Laser Eutectic Bonder are commercialized and selling to micro display manufacturers.